OSC-15801-300中文资料
- 以下是15801123的中文资料
- 大小：32.03KB
- 厂家：MOLEX1[Molex Electronics Ltd.]
- 描述：2.54mm Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing Part Number: 15-80-1123 Series image - Reference only Status: Contact Molex Series: 70567 Category: PCB Headers Overview: C-Grid? / SL? Products Old Part Number: 705670480 Mates With Part(s): 70013 Interim Clip Product Environmental Compliance EU RoHS: ELV and RoHS Compliant China RoHS: REACH SVHC: Low-Halogen Status: Not Reviewed Status Contact Molex Category PCB Headers Series 70567 Application Signal, Wire-to-Board Overview C-Grid? / SL? Products Product Name C-Grid? Breakaway No Circuits (Loaded) 12 Circuits (maximum) 12 Color - Resin Black Durability (mating cycles max) 25 First Mate / Last Break No Glow-Wire Compliant No Guide to Mating Part No Keying to Mating Part None Lock to Mating Part Yes Material - Metal Brass, Phosphor Bronze Material -
OSC-15801-300供应商
更新时间:2022-12-31 06:51:26- 供应商
- 产品型号
- 服务标识
- 数量
- 厂商
- 封装/批号
- 说明
- 询价
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OSC-15801-300
-
6013
-
DIP/21+
-
军用单位指定合供方/只做原装,自家现货
-
OSC-15801-300
-
5270
-
-/21+
-
-
-
OSC-15801-300
-
1001
-
DIP/24+
-
原厂原装现货
-
OSC-15801-300
-
11494
-
-/22+
-
-
-
OSC-15801-300
-
7
-
-/12+
-
以质为本，只做原装正品
-
OSC-15801-300
-
4
-
-/-
-
自己现货，深圳交易
-
OSC-15801-300
-
2
-
-/21+
-
20-24W
-
OSC-15801-300
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12500
-
-/24+
-
100%原装深圳现货
-
OSC-15801-300 IC
-
10
-
19+/DIP
-
原装原盒现货公司优势产品
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